Heat conduction within linear thermoelasticity /

Heat conduction within linear thermoelasticity /

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Bibliographic Details
Main Author: Day, William Alan
Format: Book
Language:English
Published: New York : Springer-Verlag, ©1985.
Series:Springer tracts in natural philosophy ; v. 30.
Subjects:
Thermoelasticity.
Heat equation > Numerical solutions.
parabolikus egyenletek
termodinamika
Thermoélasticité.
Wärmeleitungsgleichung
Numerisches Verfahren
Thermoelastizität
Warmtegeleiding.
Thermo-elasticiteit.
Thermocinétique.
Wärmeleitungsgleichung.
Numerisches Verfahren.
Thermoelastizität.

RPI

Holdings details from RPI
Call Number: QA933 .D38 1985