Heat transfer in electronic systems, 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

Heat transfer in electronic systems, 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 /

Bibliographic Details
Corporate Authors: International Mechanical Engineering Congress and Exposition Chicago, Ill., American Society of Mechanical Engineers. Heat Transfer Division
Other Authors: Wirtz, R. A.
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : American Society of Mechanical Engineers, c1994.
Series:HTD (Series) ; vol. 292.
Subjects:
Electronic apparatus and appliances > Cooling > Congresses.
Heat > Transmission > Congresses.
Electronic packaging > Congresses.

RIT

Holdings details from RIT
Call Number: TJ260 .I625 vol. 292